Latest News

Find out what’s going on in the electronics design industry

Packed full of the most up to date stories breaking in the industry. Be sure to understand industry changes as they happen.

Diagnosing Failure in Ball Grid Array (BGA) Solder Bonds
Ball grid arrays are increasingly common in modern electrical equipment but are one of the most difficult types of components to attach to circuit boards and are prone to failure caused either by errors in the assembly process or during use as a result of environmental conditions that induce excessive stresses to solder joints.

Introducing Bob Willis
Among many accolades Bob Willis has received a Soldertec/Tin Technology Global Lead-Free Award for his contribution to industry. Visit this page to see highlights of some of the support tools Bob has made available on Lead-Free Process Development.

Disappearing Solder with a Lead-Free Process
Bob Willis addresses the frequently asked question “Why do we see changing volumes in our lead-free solder joints?” Although lead-free materials do have a different density the actually talking about the loss of solder to the component terminations during re-flow.